Improved stability for overclocking Increased efficiency Intel® XMP 3.0 certified AMD EXPO certified Qualified by the world’s leading motherboard manufacturers* Low-profile heat spreader design in black or white
Technical Specifications
SKU
KKF560C30BBEK2-32
Cas Latency
30
Internal Memory
32 GB
Memory Layout (Modules X Size)
2 x 16 GB
Internal Memory Type
DDR5
Memory Data Transfer Rate
6000 MT/s
Component For
PC
Memory Form Factor
288-pin DIMM
Buffered Memory Type
Unregistered (unbuffered)
Memory Voltage
1.35 V
Amd Extended Profiles For Overclocking (Expo) Version